The hammer that follow solder is attacked prevent thin plate to solder the technology research of hot crack

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Summary: In the light of the thin plate when soldering component part generation solders the drawback with hot crack big liability, set out from mechanical angle, use what attack along with solder hammer to solder new technology, use experiment and test technology, will achieve prevent thin plate to solder the purpose of hot crack, open up is solved solder the new approach of hot crack. Discussed to attack the fundamental that prevents hot crack along with solder hammer, contrasted groovy solder condition falls and attack craft condition to fall along with solder hammer, the crackle of test specimen leads a case, test result makes clear: The hammer that follow solder is attacked can prevent effectively to solder the generation of hot crack. Keyword: The hammer that follow solder is attacked solder crackle of interval of temperature of hot crack brittleness leads 0 introductive hot crack is the generation below the high temperature when soldering. According to stuff of place solder metal different, interval of the form that produces hot crack, temperature and main reason also have each different. About soldering hot tearing grain is talked, abroad in 20 centuries 50 time had begun to consider, current and accepted more perfect is theory of в of о of р of о of х of П р о . This theory thinks the generation of crystallization crackle basically depended on the following 3 respects: The size of brittleness temperature interval, the ductility that inside brittleness temperature interval alloy place has and in metal of brittleness temperature interval be out of shape rate size. Solder hot crack is metallurgy element and mechanical element the result of joint action, soldering the control respect of hot crack, basically be from metallurgy angle sets out before, try to improve solder metallic crack resistance. But prevent hot crack to have its limitation from metallurgy angle. Prevent not easily to seam the liquefacient crackle of the area nearly on one hand, because this is planted,hot crack basically is concerned with mother ability part. Because introduce as heterogeneous as mother capable person welding wire,may sacrifice on the other hand partial connect performance characteristics. Accordingly, to thin plate, sheet is controlled from metallurgy angle solder hot crack is special difficulty. And prevent to solder to the essence of hot crack is adjusted namely and improve the stress when soldering and condition of meet an emergency from mechanical angle, the welding line that takes proper measure to make be in brittleness temperature interval namely or metal of hot influence area bear the one pressurization outside planting shrinks meet an emergency, solder in order to offset caky systole and hot systole reach what exterior stress causes to send in caky process crack drawing meet an emergency. Mechanical angle prevents to solder the main method of hot crack has: Grind pressing a law to attack a method along with solder hammer is a kind of new control solders the mechanical method of hot crack, the fundamental of this kind of method and grind the likeness that control a standard. But the hammer that follow solder attacks with grind the photograph that control a standard to compare the distinct advantage that has his again: Experimental equipment simple, quality is light, and can be applied to extensively have straight welding line and the welder that seal closed circuit welding line, solder to control hot crack and welding line are transverse reach fore-and-aft be out of shape very effective. Accordingly, the hammer that follow solder attacks craft to solder in control hot crack and solder the foreground that is out of shape the research of the respect has light. The 1 hammer that follow solder attacks a law to prevent to solder the fundamental of hot crack 1.

The basic mechanism that 1 hot crack produces prevents to solder to explain the hammer that follow solder is attacked better the fundamental of hot crack, discuss above all, groovy solder condition issues the basic mechanism that hot crack produces. Will tell from mechanical angle, solder because meet an emergency of drawing of susceptive of area metal place is affected to lead the critical meet an emergency that is more than them in welding line of brittleness temperature interval or heat,the generation of hot crack is (CST) , if pursue,1 is shown. In type, the in-house meet an emergency that ε is welding line or hot influence gets when the area is cooling or true meet an emergency, t is temperature. The E that set ε is value of apparent meet an emergency, t is thermal strain, α is hot coefficient of expansion of the metal, criterion when, can prevent to solder the generation of hot crack. 1.

The 2 hammer that follow solder are attacked prevent to solder the fundamental of hot crack is soldering in the process, hot crack often arises at brittleness temperature interval (BTR) inside, contented D ε / when condition of DT > CST, can arise solder hot crack. When welding line or metal of hot influence area are in brittleness temperature interval, in bath stretch weight is placed inside rear and certain distance, follow rear and synchronous hammer attacks welding torch two side of BTR metal, if pursue,2 are shown. Because peen distance bath is closer, the metal of peen lower part is in higher temperature. Accordingly, peen hammer knocks welding line when two side metal, below the action that knocks power in peen hammer, the meeting is right the welding line that is in BTR or generation of metal of hot influence area are transverse press C of ε of meet an emergency, in order to satisfy D ε / DT-d ε C/dT<CST, quits when soldering inhomogenous heat of generation send crack pull meet an emergency, rise to prevent to solder thereby the purpose of hot crack. 2 tests result and analysis the article is soldering in the craft experiment of hot crack, solder the method is chosen communication is automatic solder of arc of tungsten pole argon, test specimen is solder the 2A12 aluminium alloy with hot crack big liability, use the kind of exterior frit apply that does not write silk to solder, use gradient cabined spend clamping apparatus, through adjusting clamping force Fr and clip hold distance Lr neatly change is cabined degree, can reflect the true crackle action below actual production condition thereby. The course is produced in actual solder deliver a child in, workpiece does not arise certainly solder hot crack, and in this experiment, use this kind of gradient cabined spend clamping apparatus to arise more slashing cabined degree, main purpose is to make experimental test specimen is soldering the generation in the process solders hot crack, so that test and verify hits control along with solder hammer,solder the effectiveness of hot crack. With crackle rate Lcr% regards assess of hot crack tendency as index in the experiment, its expression is as follows:   of length of path of solder of Ltotal- of total length of crackle of the Lcr- in Lcr%=Lcr/Ltotal type 2.

1 experiment test specimen attacks craft test in the hammer that follow solder in, solder to be opposite better hot crack undertakes study, the test specimen of the × 2 Mm of 100 Mm of 150 Mm × that if the graph is shown 3 times,used. 2.

Below condition of 2 groovy solder cabined the influence that spends pair of crackle rate 2.

2.

1 cabined force to soldering the influence of hot crack pursues 4 gave out clip holds distance Lr=20 Mm, end receiving arc  of cabined force F receives =120 N.

When M, result of hot crack test solders when the arc since the change carries cabined force F to rise. By the graph knowable, when should removing arc to carry the =0 since cabined force F, crackle is caused from end removing solder, crackle rate is top, follow along with solder crack, crackle is perforative and whole solder path. Try appropriately cabined (the =20 Nom since F) , crackle rate is reduced significantly. Continue to increase cabined power, crackle rate falls change delay, weldment leaves the arc hole crackle with have certain only. Graph 5 gave out clip holds distance Lr=20 Mm, end removing arc when the =20 Nom since cabined force F, result of hot crack test solders when the change receives arc to carry  of cabined force F to close. Can see by the graph, as the addition that receives arc to carry cabined power, crackle rate increases gradually and tend finally stable. 2.

2.

2 clip maintain a distance the impact that to soldering hot crack leads pursues the 6 clip when giving out to remove  of =20 Nom, F to receive =120 Nom for F when cabined force maintain a distance the impact that to soldering hot crack leads. By can see in the graph, hold the addition of the distance as clip, crackle rate is reduced gradually. When clip holds a distance to be more than 60 Mm, test specimen is soldering arch goes up in the process serious, unwarrantable already solder normally. When the =20 Nom since F, F receives =120 Nom, Lr=20 Mm, generation receives arc apparently to carry crackle. 2.

The 3 hammer that follow solder attack the impact that the parameter below the condition leads to crackle to be in this experiment, for test and verify the hammer that follow solder attacks pair of control to solder the effectiveness of hot crack, used appear solder the experimental parameter with hot crack bigger liability: Clip holds distance Lr=20 Mm, end removing arc the =40 Nom since cabined force F, end receiving arc is cabined force F receives =120 Nom. Here removes arc to carry cabined force to be 40 Nom, did not use lesser cabined power, because should remove arc to carry when cabined force is lesser, crackle is removing arc to carry craze commonly, go against the craft test that has following solder hammer attacking, accordingly, used above experiment parameter. The hammer that follow solder is attacked to soldering the control of hot crack is made with, its influence parameter is more, be like: Hammer attacks force, hammer to strike a space (the distance of peen and welding torch) , hammer attacks the position, hammer to attack appearance of frequency, peen to wait. Two parameter basically discuss in the article: Hammer attacks force P and hammer to attack distance R hammer. 2.

3.

1 hammer knocks power to soldering the influence of hot crack pursues 7 gave out hammer knocks power to soldering the influence of hot crack, hammer attacks =20 Mm of distance R hammer. Can see from inside the graph, hammer attacks force to be in be less than 2 MPa and the crackle rate of the weldment when be more than 5 MPa to all be compared big, hammer attacks force 2~5 MPa between when crackle rate is inferior, basically attribute arc hole flaw. Accordingly, when hammer attacks force to be inside this limits, can control effectively solder the generation of hot crack. Because be attacked when hammer when force is lesser, the inadequacy of quantity of meet an emergency that hammer attacks action to form solders at offsetting in the process inhomogenous heat those who form send crack pull meet an emergency, the effect that controls hot crack is not apparent. Attack when hammer when power is greater, hammer is attacked can bring about solder the oscillation with bath larger generation, can promote the farther generation of hot crack instead. Accordingly, below this experimental condition, hammer attacks force to be 2~5 MPa limits inside when, it is better that hammer strikes craft effect. 2.

3.

2 hammer strike a space to soldering the influence of hot crack is in the experiment, hammer strikes a space to soldering the influence of hot crack also is compared apparent, if the graph is shown 8 times, experimental hammer attacks force to be P=4 MPa. The result makes clear: Rate of the crackle when hammer attacks =17 Mm of distance R hammer is older, rate of the crackle when hammer attacks =20 Mm of distance R hammer is minor, and the accretion that strikes a space along with hammer, crackle rate increases. Because be attacked when hammer when the distance is lesser, hammer attacks the position to leave solder electric arc is too close, hammer is attacked to soldering bath produces serious vibration, can promote the generation of hot crack. Attack when hammer when the space is larger, the sensitive position that the position that hammer attacks leaves generation hot crack too far, not apparent also to reducing the effect of hot crack. Accordingly, below this experimental condition, hammer attacks a distance to should be controlled control in 20~23 Mm, the effect that hammer strikes craft to control hot crack is better. 3 conclusion solder in the light of laminose component generation the drawback with hot crack big liability, the article solders to attacking craft to control along with solder hammer the effectiveness experiment of hot crack undertook study, study achievement makes clear: (The test specimen of the × 2 Mm</sub> of 100 Mm of 150 Mm × that 1) uses to this laboratory, below certain cabined power and cabined distance condition, hammer attacks force to be 2~5 MPa limits inside, when hammer attacks space control to be controlled in 20~23 Mm, the hammer that follow solder attacks technology control to solder the effect of hot crack is better, and mix to different test specimen solder condition, should use solder differently hammer hits parameter. (2) attacks craft test along with solder hammer is to be in more slashing cabined spend what undertake below the condition, but solder what hot crack rate compares groovy solder condition to fall apparently however is small, and the cabined condition in receiving production does not have actual solder so slashing. Accordingly, the hammer that follow solder attacks craft to decide effectively control to solder in actual production the generation of hot crack. CNC Milling CNC Machining